Installed laser processing machine - List of Manufacturers, Suppliers, Companies and Products

Laser processing machine equipped with stealth dicing - "Free sample processing available"

Amazing processing speed! Replacement of dicing with laser! High-speed, high-quality, and high-precision cutting of transparent materials is now possible!

Equipped with Hamamatsu Photonics' patented technology "Stealth Dicing Engine," it has become possible to cut transparent materials that were previously said to be difficult to process with precision and high accuracy. We offer free sample processing, so please feel free to contact us. 【Features】 ■ Target materials SiC (silicon carbide), LT (lithium tantalate)/LN (lithium niobate), GaN (gallium nitride), reinforced glass, glass ■ Processing of thin samples under 100μ is also possible ■ Achieves high throughput through high-speed/high-precision processing *For more details, please contact us or download the PDF.

Company：西進商事
Price：Other

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Laser processing machine equipped with stealth dicing for electronic components.

Achieving high density! High-speed and high-quality cutting processing of transparent materials.

In the electronic components industry, as miniaturization and high density progress, there is a demand for smaller and more precise processing. Particularly in the processing of transparent materials, it is important to suppress fine cracks and chipping to improve yield. The stealth dicing-equipped laser processing machine incorporates Hamamatsu Photonics' patented technology, the stealth dicing engine, to address these challenges. 【Application Scenes】 - Smartphone components - LED-related components - Processing of special materials such as SiC, sapphire, quartz, and LiNbO₃ 【Effects of Introduction】 - Improved yield through high-precision dicing - Reduced production takt time through high-speed processing - Compatibility with a wide variety of materials - Adaptation to small chip sizes

Company：西進商事
Price：Other

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Aerospace Stealth Dicing Laser Processing Machine

Achieving high-speed, high-quality, and high-precision cutting of transparent materials!

In the aerospace industry, weight reduction is a critical issue, and hard materials such as sapphire and SiC, as well as special materials like quartz, are used for aircraft and component materials. The precise processing of these materials significantly affects product performance and reliability. Laser processing machines equipped with stealth dicing achieve high-precision processing for these transparent materials, contributing to improved yield and stabilized quality. 【Application Scenarios】 - Precision processing of hard materials such as sapphire and SiC - Processing of special materials like quartz and LiNbO₃ - Component manufacturing aimed at weight reduction 【Effects of Implementation】 - Improved yield by suppressing fine cracks and chipping - Reduced production takt time through high-speed processing - Establishment of a flexible production system capable of handling a wide variety of materials

Company：西進商事
Price：Other

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Laser processing machine equipped with stealth dicing for automobiles

Contributing to the miniaturization and high-precision processing of automotive parts!

In the automotive industry, the miniaturization and high performance of electrical components are progressing, leading to a demand for precise cutting processes of substrates and electronic components. In particular, automotive electronic components require high reliability under harsh conditions, making processing accuracy and quality crucial. Laser processing machines equipped with stealth dicing achieve high-precision dicing of transparent materials and contribute to improved yield and stabilized quality by suppressing fine cracks and chipping. 【Application Scenarios】 - Processing of automotive sensor components - Processing of LED headlight components - Manufacturing of small electronic components 【Benefits of Implementation】 - Improved yield through high-precision cutting processes - Reduced production takt time - Compatibility with a wide range of materials

Company：西進商事
Price：Other

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Laser processing machine equipped with stealth dicing for wearables

For processing transparent materials for small, lightweight devices! Achieving high speed, high quality, and high precision.

In the wearable device industry, miniaturization and lightweight design are advancing, leading to a demand for precise cutting of transparent materials. In particular, microfabrication technology is crucial to accommodate the thinning of devices and high-density mounting. Conventional processing methods are prone to material cracking and chipping, which can lead to reduced yield and unstable quality. Our laser processing machine equipped with stealth dicing enables precise processing of transparent materials, contributing to the improvement of wearable device quality. 【Application Scenarios】 - Processing of transparent covers for compact and lightweight devices - Cutting of display components - Manufacturing of LED-related parts 【Benefits of Implementation】 - Improved yield - Stable supply of high-quality products - Reduced production takt time

Company：西進商事
Price：Other

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Laser processing machine equipped with stealth dicing for optical components.

Achieving high-speed, high-quality, and high-precision cutting processing of transparent materials!

In the optical components industry, precise cutting of transparent materials such as lenses and prisms is required. In particular, the processing accuracy that affects product performance and high-quality processing to improve yield are crucial. The conventional blade method tends to cause fine cracks and chipping, which leads to a decrease in yield. Our laser processing machine equipped with the stealth dicing technology, patented by Hamamatsu Photonics, addresses these challenges. 【Application Scenarios】 - Manufacturing of optical components such as lenses, prisms, and filters - Cutting of transparent materials such as sapphire, SiC, quartz, and LiNbO₃ - Precision processing of smartphone components, LED-related parts, and more 【Benefits of Implementation】 - Reduces fine cracks and chipping, improving yield - Shortens production takt time through high-speed processing - Accommodates a wide variety of materials, establishing a flexible production system

Company：西進商事
Price：Other

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Laser processing machine equipped with stealth dicing for research institutions.

Prototyping with transparent materials! Achieving high-speed, high-quality, and high-precision processing.

In prototype development at research institutions, precise processing of diverse materials is required. Particularly in the processing of transparent materials, it is important to suppress fine cracks and chipping to create high-quality samples. The stealth dicing-equipped laser processing machine is equipped with Hamamatsu Photonics' patented technology, the stealth dicing engine, enabling high-precision dicing of transparent materials. 【Application Scenarios】 - Research and development using transparent materials - Production of prototypes - Material property evaluation 【Effects of Introduction】 - Production of high-quality prototypes - Improved yield - Increased efficiency in research and development