Laser processing machine equipped with stealth dicing - "Free sample processing available"
Amazing processing speed! Replacement of dicing with laser! High-speed, high-quality, and high-precision cutting of transparent materials is now possible!
Equipped with Hamamatsu Photonics' patented technology "Stealth Dicing Engine," it has become possible to cut transparent materials that were previously said to be difficult to process with precision and high accuracy. We offer free sample processing, so please feel free to contact us. 【Features】 ■ Target materials SiC (silicon carbide), LT (lithium tantalate)/LN (lithium niobate), GaN (gallium nitride), reinforced glass, glass ■ Processing of thin samples under 100μ is also possible ■ Achieves high throughput through high-speed/high-precision processing *For more details, please contact us or download the PDF.
- Company：西進商事
- Price：Other
